Inventor

PARK HO-SIK

KR11 patents

⚠️ This page may combine multiple inventors who share the name “PARK HO-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

5 patents

US7893527B2Feb 22, 2011

Semiconductor plastic package and fabricating method thereof

SAMSUNG ELECTRO MECH14 citations82

US10779414B2Sep 15, 2020

Electronic component embedded printed circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH3 citations72

US10529476B2Jan 7, 2020

Coil component and method for manufacturing the same

SAMSUNG ELECTRO MECH1 citations61

US8356405B2Jan 22, 2013

Method of manufacturing printed circuit board

SAMSUNG ELECTRO MECH2 citations59

US9674944B2Jun 6, 2017

Printed circuit board and manufacturing method thereof

SAMSUNG ELECTRO MECH0 citations51

SOHN KEUNG-JIN

2 patents

US8397378B2Mar 19, 2013

Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board

SOHN KEUNG-JIN2 citations56

US8450618B2May 28, 2013

Printed circuit board with reinforced thermoplastic resin layer

SOHN KEUNG-JIN0 citations46

SHIN JOON-SIK

1 patent

US8647926B2Feb 11, 2014

Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip

SHIN JOON-SIK4 citations68

PARK JUNG-HWAN

1 patent

US8499441B2Aug 6, 2013

Method of manufacturing a printed circuit board

PARK JUNG-HWAN2 citations60

SOHN KEUNGJIN

1 patent

US8997340B2Apr 7, 2015

Method of manufacturing and insulating sheet

SOHN KEUNGJIN1 citations44

BAE TAE KYUN

1 patent

US8720049B2May 13, 2014

Printed circuit board and method for fabricating the same

BAE TAE KYUN0 citations42