Inventor
HAYATA KAZUNORI
JP8 patents
⚠️ This page may combine multiple inventors who share the name “HAYATA KAZUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSENSE INC
4 patentsUS11012790B2May 18, 2021
Flipchip package
INVENSENSE INC0 citations59
US12133049B2Oct 29, 2024
Reduced light reflection package
INVENSENSE INC0 citations53
US11800297B2Oct 24, 2023
Reduced light reflection package
INVENSENSE INC0 citations53
US11760627B2Sep 19, 2023
MEMS stress reduction structure embedded into package
INVENSENSE INC0 citations51
TEXAS INSTRUMENTS INC
3 patentsUS8815648B1Aug 26, 2014
Multi-step sintering of metal paste for semiconductor device wire bonding
TEXAS INSTRUMENTS INC25 citations87
US8716068B2May 6, 2014
Method for contacting agglomerate terminals of semiconductor packages
TEXAS INSTRUMENTS INC2 citations61
US9536753B2Jan 3, 2017
Circuit substrate interconnect
TEXAS INSTRUMENTS INC1 citations43