P

Inventor

TENG HUNG-AN

TW8 patents
⚠️ This page may combine multiple inventors who share the name “TENG HUNG-AN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

4 patents
US9640490B2May 2, 2017

Through silicon via keep out zone formation method and system

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10056347B2Aug 21, 2018

Bump structure for yield improvement

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10290604B2May 14, 2019

Substrateless integrated circuit packages and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9842825B2Dec 12, 2017

Substrateless integrated circuit packages and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72

TAIWAN SEMICONDUCTOR MFG

2 patents
US8836094B1Sep 16, 2014

Package device including an opening in a flexible substrate and methods of forming the same

TAIWAN SEMICONDUCTOR MFG7 citations84
US9054166B2Jun 9, 2015

Through silicon via keep out zone formation method and system

TAIWAN SEMICONDUCTOR MFG4 citations73

HSIEH CHENG-CHIEH

1 patent
US8604619B2Dec 10, 2013

Through silicon via keep out zone formation along different crystal orientations

HSIEH CHENG-CHIEH6 citations82

CHIU TZU-WEI

1 patent
US9553053B2Jan 24, 2017

Bump structure for yield improvement

CHIU TZU-WEI1 citations51