Inventor
FRITZ DONALD S
US8 patents
Patents
8 patentsUS6882041B1Apr 19, 2005
Thermally enhanced metal capped BGA package
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US7144756B1Dec 5, 2006
Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate
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US6909176B1Jun 21, 2005
Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate
ALTERA CORP41 citations92
US6734540B2May 11, 2004
Semiconductor package with stress inhibiting intermediate mounting substrate
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US5757070AMay 26, 1998
Integrated circuit package
ALTERA CORP49 citations91
US5744383AApr 28, 1998
Integrated circuit package fabrication method
ALTERA CORP46 citations91
US6969636B1Nov 29, 2005
Semiconductor package with stress inhibiting intermediate mounting substrate
ALTERA CORP5 citations72
US7319051B2Jan 15, 2008
Thermally enhanced metal capped BGA package
ALTERA CORP6 citations71