Inventor

ORCUTT JOHN W

US60 patents

⚠️ This page may combine multiple inventors who share the name “ORCUTT JOHN W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ORCUTT JOHN W

TEXAS INSTRUMENTS INC

MEMS wafer level package

Optical switching apparatus

Trench scribe line for decreased chip spacing

MEMS wafer level package

Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal

Integrated circuit package providing bond wire clearance over intervening conductive regions

Integrated circuit device with textured bar cover

Stacked interdigitated lead frame assembly

Torsional hinged mirror assembly with central spines and perimeter ridges to reduce flexing

Multilayered oscillating device with spine support

Molded ball grid array package mold die

Fine pitch bonding technique

Method of protecting bond wires during molding and handling

Low loop wire bonding

Method and apparatus for fine pitch wire bonding using a shaved capillary

Method for semiconductor device packaging

Condition responsive apparatus having freely disposed disc

Multilayered oscillating functional surface

Packaged micromirror assembly with in-package mirror position feedback

Polar bond head

Carrier for integrated circuit

Multilayer torsional hinged mirror with a recessed drive/sensing permanent magnet

Resonant oscillating device actuator structure

Torsionally hinged devices with support anchors

Plastic surface mounted high pinout integrated circuit package

Proportional stroke automatic temperature control system

Apparatus for automatic cable calibration

Process for manufacturing a two-axis mirror

Polar bond head

Torsional hinged device with improved coupling between a magnet mounted to said device and an electrical coil

Two axis low inertia torsional hinged optical device

Packaged micromirror assembly with in-package mirror position passive component feedback

Fine pitch bonding technique

Proportional stroke automatic temperature control system

Condition responsive apparatus having an improved motion transfer member

Multiple port multiple temperature thermally responsive valve

Magnet on frame oscillating device

Pivoting mirror with improved magnetic drive

Optical switching apparatus

Carrier for integrated circuit

Lead frame type plastic ball grid array package with pre-assembled ball type contacts

Condition responsive apparatus with motion transfer member to movable contact arm

Condition responsive electrical switch having improved bridging contact means

Silicon mirrors having reduced hinge stress from temperature variations

Single piece torsional hinged device with central spines and perimeter ridges to reduce flexing

Low cost torsional hinge mirror package with non-rotating magnetic drive

Single torsional hinge mirror

Bracket for supporting a torsional hinge mirror with reduced hinge stress

Temperature stabilized mirror for switching optical signals

ORCUTT JOHN W

Wire looping method during wire bonding