Inventor

ADVINCULA JR ABELARDO HADAP

SG3 patents

⚠️ This page may combine multiple inventors who share the name “ADVINCULA JR ABELARDO HADAP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US7868471B2Jan 11, 2011

Integrated circuit package-in-package system with leads

STATS CHIPPAC LTD22 citations91

US7732901B2Jun 8, 2010

Integrated circuit package system with isloated leads

STATS CHIPPAC LTD6 citations72

TAY LIONEL CHIEN HUI

1 patent

US8421198B2Apr 16, 2013

Integrated circuit package system with external interconnects at high density

TAY LIONEL CHIEN HUI0 citations50