Inventor
CHEN LI-CHIH
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHEN LI-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
8 patentsUS6743660B2Jun 1, 2004
Method of making a wafer level chip scale package
TAIWAN SEMICONDUCTOR MFG110 citations97
US6756294B1Jun 29, 2004
Method for improving bump reliability for flip chip devices
TAIWAN SEMICONDUCTOR MFG53 citations96
US6636313B2Oct 21, 2003
Method of measuring photoresist and bump misalignment
TAIWAN SEMICONDUCTOR MFG37 citations92
US6974659B2Dec 13, 2005
Method of forming a solder ball using a thermally stable resinous protective layer
TAIWAN SEMICONDUCTOR MFG15 citations84
US7276454B2Oct 2, 2007
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
TAIWAN SEMICONDUCTOR MFG5 citations73
US7134199B2Nov 14, 2006
Fluxless bumping process
TAIWAN SEMICONDUCTOR MFG10 citations73
US7906425B2Mar 15, 2011
Fluxless bumping process
TAIWAN SEMICONDUCTOR MFG4 citations62
US6802250B2Oct 12, 2004
Stencil design for solder paste printing
TAIWAN SEMICONDUCTOR MFG1 citations52