Inventor
TSAO CHANG-CHEN
TW8 patents
Patents
8 patentsUS10569520B2Feb 25, 2020
Wafer debonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US10155369B2Dec 18, 2018
Wafer debonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10889097B2Jan 12, 2021
Wafer debonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11670524B2Jun 6, 2023
Fully automated wafer debonding system and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US12211727B2Jan 28, 2025
Simultaneous bonding approach for high quality wafer stacking
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11621186B2Apr 4, 2023
Simultaneous bonding approach for high quality wafer stacking applications
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094575B2Aug 17, 2021
Simultaneous bonding approach for high quality wafer stacking applications
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12543526B2Feb 3, 2026
Fully automated wafer debonding system and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58