Inventor

WANG YU-PO

TW36 patents

⚠️ This page may combine multiple inventors who share the name “WANG YU-PO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG YU-PO

SILICONWARE PRECISION INDUSTRIES CO LTD

Stacked semiconductor structure and fabrication method thereof

Semiconductor package substrate

Method for fabricating semiconductor package free of substrate

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package

Semiconductor package free of substrate and fabrication method thereof

Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same

Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

Method for fabricating semiconductor package with build-up layers formed on chip

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package and substrate structure thereof

High electrical performance semiconductor package

Substrate with dam bar structure for smooth flow of encapsulating resin

Semiconductor package substrate

Cavity-down ball grid array semiconductor package with heat spreader

Method for fabricating semiconductor package free of substrate

Semiconductor package and fabrication method thereof

Method for fabricating semiconductor package free of substrate

Semiconductor package and method for fabricating the same

Electronic package of two vertically stacked chips with chip-to-chip bump connections and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Semiconductor package free of substrate and fabrication method thereof

Fabrication method of packaging substrate

Electronic package and manufacturing method thereof

WINBOND ELECTRONICS CORP

Semiconductor memory structure and method for forming the same

Semiconductor structure and method for forming the same

HUANG CHIEN-PING

Method of fabricating stacked semiconductor structure

CHEN CHIA-YIN

Semiconductor package, packaging substrate and fabrication method thereof

CHANG CHIANG-CHENG

Package substrate having landless conductive traces

TZENG YUAN-LIN

Flip-chip semiconductor package and chip carrier for preventing corner delamination