Inventor

HU CHUAN

US73 patents

⚠️ This page may combine multiple inventors who share the name “HU CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HU CHUAN

INTEL CORP

Thinned die integrated circuit package

Electronic assemblies having a low processing temperature

Wafer-level diamond spreader

Fluxless die-to-heat spreader bonding using thermal interface material

Fluxless die-to-heat spreader bonding using thermal interface material

Thinned die integrated circuit package

Method of forming electronic package having fluid-conducting channel

Integrated circuit coolant microchannel assembly with targeted channel configuration

Electronic packages, assemblies, and systems with fluid cooling

Bumpless die and heat spreader lid module bonded to bumped die carrier

Thermal management of dies on a secondary side of a package

Package with integrated wick layer and method for heat removal

Magnetic nanocomposite materials and passive components formed therewith

Package with dielectric or anisotropic conductive (ACF) buildup layer

Wafer-level assembly of heat spreaders for dual IHS packages

Single layer low cost wafer level packaging for SFF SiP

Packaged semiconductor die and CTE-engineering die pair

Single layer low cost wafer level packaging for SFF SiP

Wavy interconnect for bendable and stretchable devices

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

Integrated circuit package assemblies including a glass solder mask layer

Solder in cavity interconnection structures

Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices

Diamond substrate formation for electronic assemblies

Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same

Microelectronic die having a thermoelectric module

Densely packed thermoelectric cooler

Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices

Solder in cavity interconnection technology

HU CHUAN

Single layer low cost wafer level packaging for SFF SiP

Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer

Off-plane conductive line interconnects in microelectronic devices

Solder in cavity interconnection technology

Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages

Die-warpage compensation structures for thinned-die devices, and methods of assembling same

Solder in cavity interconnection structures

Packaged semiconductor die and CTE-engineering die pair

MICROSOFT TECHNOLOGY LICENSING LLC

Extracting key phrase candidates from documents and producing topical authority ranking

Keyphase extraction beyond language modeling

Keyphrase extraction beyond language modeling

LU DAOQIANG

Microelectronic package having direct contact heat spreader and method of manufacturing same

Microelectronic package having direct contact heat spreader and method of manufacturing same

SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD

Integrated circuit multichip stacked packaging structure and method

Chip wiring method and structure

LYNXI TECH CO LTD

Neural network mapping method and apparatus

Method and device for controlling storage format of on-chip storage resource

MA QING

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

NAIR VIJAY K

Method apparatus and material for radio frequency passives and antennas

OPPLE LIGHTING CO LTD

Spotlight lamp with snap-fit anti-glare ring

INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES

Touch control substrate and preparation method thereof, touch control module and display device