Inventor
CHAU DAVID S
US5 patents
Patents
5 patentsUS7336487B1Feb 26, 2008
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant
INTEL CORP50 citations95
US6868898B2Mar 22, 2005
Heat pipe having an inner retaining wall for wicking components
INTEL CORP22 citations91
US7739876B2Jun 22, 2010
Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator
INTEL CORP10 citations82
US7560640B2Jul 14, 2009
Densely packed thermoelectric cooler
INTEL CORP4 citations61
US7430870B2Oct 7, 2008
Localized microelectronic cooling
INTEL CORP2 citations61