Inventor

LEE KONG WENG

MY8 patents

⚠️ This page may combine multiple inventors who share the name “LEE KONG WENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AVAGO TECH ECBU IP SG PTE LTD

2 patents

US7919787B2Apr 5, 2011

Semiconductor device with a light emitting semiconductor die

AVAGO TECH ECBU IP SG PTE LTD13 citations82

US7256486B2Aug 14, 2007

Packaging device for semiconductor die, semiconductor device incorporating same and method of making same

AVAGO TECH ECBU IP SG PTE LTD8 citations72

LUMENTUM OPERATIONS LLC

2 patents

US9728935B2Aug 8, 2017

Chip-scale package and semiconductor device assembly

LUMENTUM OPERATIONS LLC0 citations50

US10763639B2Sep 1, 2020

Emitter-on-sub-mount device

LUMENTUM OPERATIONS LLC0 citations45

LEE KONG WENG

2 patents

US9123869B2Sep 1, 2015

Semiconductor device with a light emitting semiconductor die

LEE KONG WENG1 citations47

US8537873B2Sep 17, 2013

High power surface mount technology package for side emitting laser diode

LEE KONG WENG1 citations47

AVAGO TECHNOLOGIES ECBUIP SING

1 patent

US7279355B2Oct 9, 2007

Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same

AVAGO TECHNOLOGIES ECBUIP SING7 citations71

JDS UNIPHASE CORP

1 patent

US9300112B2Mar 29, 2016

Packaged laser diode and method of packaging a laser diode

JDS UNIPHASE CORP2 citations60