Inventor

MASAKI SEISHI

JP6 patents

⚠️ This page may combine multiple inventors who share the name “MASAKI SEISHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAIWA FINE CHEMICALS CO LTD

1 patent

US5618404AApr 8, 1997

Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use

DAIWA FINE CHEMICALS CO LTD29 citations92

OBATA DONI DAIWA FINE CHEMICAL

1 patent

US4459185AJul 10, 1984

Tin, lead, and tin-lead alloy plating baths

OBATA DONI DAIWA FINE CHEMICAL94 citations91

DAIWA KASEI KENKYUSHO

1 patent

US4128460ADec 5, 1978

Coloring by electrolysis of aluminum or aluminum alloys

DAIWA KASEI KENKYUSHO20 citations75

MITSUBISHI MATERIALS CORP

1 patent

US5651873AJul 29, 1997

Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface

MITSUBISHI MATERIALS CORP14 citations72

OBATA KEIGO

1 patent

US4673470AJun 16, 1987

Tin, lead, or tin-lead alloy plating bath

OBATA KEIGO12 citations67

OBATA DOHI DAIWA FINE CHEMICAL

1 patent

US4555314ANov 26, 1985

Tin-lead alloy plating bath

OBATA DOHI DAIWA FINE CHEMICAL3 citations55