P

Inventor

KOHMURA TOSHIMI

JP8 patents
⚠️ This page may combine multiple inventors who share the name “KOHMURA TOSHIMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

3 patents
US6407929B1Jun 18, 2002

Electronic package having embedded capacitors and method of fabrication therefor

INTEL CORP220 citations96
US7592202B2Sep 22, 2009

Embedding device in substrate cavity

INTEL CORP12 citations83
US7394159B2Jul 1, 2008

Delamination reduction between vias and conductive pads

INTEL CORP10 citations83

IBIDEN CO LTD

3 patents
US5822194AOct 13, 1998

Electronic part mounting device

IBIDEN CO LTD61 citations94
US6303873B1Oct 16, 2001

Electronic part module and process for manufacturing the same

IBIDEN CO LTD14 citations73
US5956237ASep 21, 1999

Primary printed wiring board

IBIDEN CO LTD7 citations72

TOYAMA MUNEHIRO

1 patent
US8115307B2Feb 14, 2012

Embedding device in substrate cavity

TOYAMA MUNEHIRO18 citations89

MITSUBISHI PETROCHEMICAL CO

1 patent
US5160783ANov 3, 1992

Epoxy resin-impregnated glass cloth sheet having adhesive layer

MITSUBISHI PETROCHEMICAL CO29 citations89