Inventor
MIYAZAKI CHUICHI
JP42 patents
⚠️ This page may combine multiple inventors who share the name “MIYAZAKI CHUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
17 patentsUS6521981B2Feb 18, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD37 citations96
US6472727B2Oct 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD31 citations96
US6342726B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD42 citations96
US6342728B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD38 citations96
US6114753ASep 5, 2000
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD50 citations95
US6642083B2Nov 4, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD17 citations93
US6365439B2Apr 2, 2002
Method of manufacturing a ball grid array type semiconductor package
HITACHI LTD17 citations93
US6355500B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD14 citations93
US6515371B2Feb 4, 2003
Semiconductor device with elastic structure and wiring
HITACHI LTD13 citations92
US6433440B1Aug 13, 2002
Semiconductor device having a porous buffer layer for semiconductor device
HITACHI LTD24 citations92
US6307269B1Oct 23, 2001
Semiconductor device with chip size package
HITACHI LTD32 citations92
US5141318AAug 25, 1992
Laser interferometer type length measuring apparatus and positioning method using the same
HITACHI LTD44 citations90
US6791194B1Sep 14, 2004
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD18 citations83
US6355975B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD4 citations74
US6353255B2Mar 5, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD6 citations74
US6639323B2Oct 28, 2003
Semiconductor device and its manufacturing method
HITACHI LTD6 citations73
US6645794B2Nov 11, 2003
Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding
HITACHI LTD2 citations62
RENESAS TECH CORP
12 patentsUS6670215B2Dec 30, 2003
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP28 citations96
US7737001B2Jun 15, 2010
Semiconductor manufacturing method
RENESAS TECH CORP20 citations93
US7420284B2Sep 2, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP39 citations92
US7148081B2Dec 12, 2006
Method of manufacturing a semiconductor device
RENESAS TECH CORP14 citations84
US7265035B2Sep 4, 2007
Semiconductor device and its manufacturing method
RENESAS TECH CORP18 citations82
US6664135B2Dec 16, 2003
Method of manufacturing a ball grid array type semiconductor package
RENESAS TECH CORP7 citations74
US7202570B2Apr 10, 2007
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
RENESAS TECH CORP6 citations73
US7038325B2May 2, 2006
Wiring tape for semiconductor device including a buffer layer having interconnected foams
RENESAS TECH CORP3 citations63
US7514294B2Apr 7, 2009
Semiconductor device and a manufacturing method of the same
RENESAS TECH CORP5 citations62
US7795741B2Sep 14, 2010
Semiconductor device
RENESAS TECH CORP3 citations61
US7759224B2Jul 20, 2010
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP4 citations61
US7452787B2Nov 18, 2008
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP4 citations61
RENESAS ELECTRONICS CORP
5 patentsUS7892949B2Feb 22, 2011
Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region
RENESAS ELECTRONICS CORP31 citations91
US10002808B2Jun 19, 2018
Semiconductor device manufacturing method and semiconductor device
RENESAS ELECTRONICS CORP2 citations72
US9070560B2Jun 30, 2015
Semiconductor chip with modified regions for dividing the chip
RENESAS ELECTRONICS CORP1 citations61
US7923292B2Apr 12, 2011
Semiconductor device
RENESAS ELECTRONICS CORP0 citations51
US8378459B2Feb 19, 2013
Semiconductor device, semiconductor wafer and manufacturing method of the same
RENESAS ELECTRONICS CORP0 citations46
ABE YOSHIYUKI
3 patentsUS8084334B2Dec 27, 2011
Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region
ABE YOSHIYUKI4 citations72
US8546244B2Oct 1, 2013
Method of manufacturing semiconductor device
ABE YOSHIYUKI2 citations62
US8772135B2Jul 8, 2014
Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof
ABE YOSHIYUKI0 citations51