Inventor
NISHI KUNIHIKO
JP104 patents
⚠️ This page may combine multiple inventors who share the name “NISHI KUNIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
42 patentsUS6291273B1Sep 18, 2001
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD208 citations99
US5777391AJul 7, 1998
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
HITACHI LTD256 citations99
US5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US5334875AAug 2, 1994
Stacked semiconductor memory device and semiconductor memory module containing the same
HITACHI LTD128 citations98
US5198888AMar 30, 1993
Semiconductor stacked device
HITACHI LTD353 citations98
US5184208AFeb 2, 1993
Semiconductor device
HITACHI LTD115 citations98
US5714405AFeb 3, 1998
Semiconductor device
HITACHI LTD98 citations97
US5095626AMar 17, 1992
Method of producing semiconductor memory packages
HITACHI LTD84 citations97
US6521981B2Feb 18, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD37 citations96
US6472727B2Oct 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD31 citations96
US6342726B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD42 citations96
US6342728B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD38 citations96
US6169325B1Jan 2, 2001
Semiconductor device
HITACHI LTD82 citations96
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5914531AJun 22, 1999
Semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD68 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5583375ADec 10, 1996
Semiconductor device with lead structure within the planar area of the device
HITACHI LTD73 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US5295297AMar 22, 1994
Method of producing semiconductor memory
HITACHI LTD75 citations96
US5266834ANov 30, 1993
Semiconductor device and an electronic device with the semiconductor devices mounted thereon
HITACHI LTD262 citations96
US4971196ANov 20, 1990
Surface package type semiconductor package
HITACHI LTD66 citations96
US4933744AJun 12, 1990
Resin encapsulated electronic devices
HITACHI LTD72 citations96
US5371044ADec 6, 1994
Method of uniformly encapsulating a semiconductor device in resin
HITACHI LTD60 citations95
US5028986AJul 2, 1991
Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
HITACHI LTD115 citations95
US4989166AJan 29, 1991
Method for synthesizing analysis model and flow analysis system
HITACHI LTD66 citations95
US5200366AApr 6, 1993
Semiconductor device, its fabrication method and molding apparatus used therefor
HITACHI LTD60 citations94
US6642083B2Nov 4, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD17 citations93
US6365439B2Apr 2, 2002
Method of manufacturing a ball grid array type semiconductor package
HITACHI LTD17 citations93
US6355500B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD14 citations93
US6162701ADec 19, 2000
Semiconductor device and method for making same
HITACHI LTD19 citations93
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US5150193ASep 22, 1992
Resin-encapsulated semiconductor device having a particular mounting structure
HITACHI LTD107 citations93
US4983110AJan 8, 1991
Resin encapsulating apparatus for semiconductor devices
HITACHI LTD23 citations93
US4954301ASep 4, 1990
Transfer molding process and an apparatus for the same
HITACHI LTD31 citations93
US4946633AAug 7, 1990
Method of producing semiconductor devices
HITACHI LTD32 citations93
US4900501AFeb 13, 1990
Method and apparatus for encapsulating semi-conductors
HITACHI LTD31 citations93
US6166911ADec 26, 2000
Semiconductor integrated circuit card assembly
HITACHI LTD28 citations92
US6114192ASep 5, 2000
Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD39 citations92
RENESAS ELECTRONICS CORP
3 patentsUSRE41721ESep 21, 2010
Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes
RENESAS ELECTRONICS CORP59 citations98
USRE41722ESep 21, 2010
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
RENESAS ELECTRONICS CORP60 citations98
USRE41478EAug 10, 2010
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
RENESAS ELECTRONICS CORP62 citations98
RENESAS TECH CORP
3 patentsUS6867123B2Mar 15, 2005
Semiconductor integrated circuit device and its manufacturing method
RENESAS TECH CORP76 citations97
US6670215B2Dec 30, 2003
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP28 citations96
US7420284B2Sep 2, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP39 citations92
NAKAMURA ATSUSHI
1 patentHITACHI ULSI SYS CO LTD
1 patentShowing the top 50 of 104 patents by PatentIndex Score.