Inventor
KIMOTO RYOSUKE
JP25 patents
⚠️ This page may combine multiple inventors who share the name “KIMOTO RYOSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
18 patentsUS5714405AFeb 3, 1998
Semiconductor device
HITACHI LTD98 citations97
US6521981B2Feb 18, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD37 citations96
US6472727B2Oct 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD31 citations96
US6342728B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD38 citations96
US6342726B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD42 citations96
US5583375ADec 10, 1996
Semiconductor device with lead structure within the planar area of the device
HITACHI LTD73 citations96
US6476467B2Nov 5, 2002
Semiconductor device and process for producing the same
HITACHI LTD56 citations95
US6642083B2Nov 4, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD17 citations93
US6365439B2Apr 2, 2002
Method of manufacturing a ball grid array type semiconductor package
HITACHI LTD17 citations93
US6355500B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD14 citations93
US6278176B1Aug 21, 2001
Semiconductor device and process for producing the same
HITACHI LTD24 citations92
US6060770AMay 9, 2000
Semiconductor device and process for producing the same
HITACHI LTD23 citations92
US6355975B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD4 citations74
US6353255B2Mar 5, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD6 citations74
US7217645B2May 15, 2007
Method for manufacturing semiconductor device and electronic device and method for calculating connection condition
HITACHI LTD8 citations73
US6146920ANov 14, 2000
Bump formation method
HITACHI LTD11 citations73
US5869888AFeb 9, 1999
Semiconductor device with lead structure on principal surface of chip
HITACHI LTD12 citations73
US6400020B1Jun 4, 2002
Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers
HITACHI LTD1 citations51
RENESAS TECH CORP
6 patentsUS6879041B2Apr 12, 2005
Semiconductor device with joint structure having lead-free solder layer over nickel layer
RENESAS TECH CORP87 citations97
US6670215B2Dec 30, 2003
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP28 citations96
US7420284B2Sep 2, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP39 citations92
US7332800B2Feb 19, 2008
Semiconductor device
RENESAS TECH CORP15 citations83
US6664135B2Dec 16, 2003
Method of manufacturing a ball grid array type semiconductor package
RENESAS TECH CORP7 citations74
US7211892B2May 1, 2007
Semiconductor device having a particular electrode structure
RENESAS TECH CORP5 citations62