P

Inventor

KIM HYUN-KI

KR91 patents
⚠️ This page may combine multiple inventors who share the name “KIM HYUN-KI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

22 patents
US7476962B2Jan 13, 2009

Stack semiconductor package formed by multiple molding and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD116 citations98
US8749510B2Jun 10, 2014

Method and apparatus for displaying graphical user interface depending on a user's contact pattern

SAMSUNG ELECTRONICS CO LTD12 citations92
US6859588B2Feb 22, 2005

Optical fiber block

SAMSUNG ELECTRONICS CO LTD20 citations89
US9111633B2Aug 18, 2015

Semiconductor memory device having sub word line driver and driving method thereof

SAMSUNG ELECTRONICS CO LTD17 citations84
US7499389B2Mar 3, 2009

Super resolution information storage medium and method of recording data thereon

SAMSUNG ELECTRONICS CO LTD19 citations84
US7485911B2Feb 3, 2009

Semiconductor device having decoupling capacitor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD9 citations84
US7442424B2Oct 28, 2008

Information storage medium having super resolution structure and apparatus for recording to and/or reproducing from the same

SAMSUNG ELECTRONICS CO LTD7 citations74
US7087284B2Aug 8, 2006

High density readable only optical disc and method of preparing the same

SAMSUNG ELECTRONICS CO LTD8 citations74
US6345131B1Feb 5, 2002

Method for manufacturing the thermo-optic switch, and method for changing optical line using the thermo-optic switch

SAMSUNG ELECTRONICS CO LTD13 citations74
US7436049B2Oct 14, 2008

Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package

SAMSUNG ELECTRONICS CO LTD7 citations73
US11069588B2Jul 20, 2021

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations72
US10068878B2Sep 4, 2018

Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB

SAMSUNG ELECTRONICS CO LTD2 citations70
US9589625B2Mar 7, 2017

Method of operating memory device and refresh method of the same

SAMSUNG ELECTRONICS CO LTD5 citations70
US10319451B2Jun 11, 2019

Semiconductor device having chip ID generation circuit

SAMSUNG ELECTRONICS CO LTD4 citations66
US9176650B2Nov 3, 2015

Method and apparatus for displaying graphical user interface depending on a user's contact pattern

SAMSUNG ELECTRONICS CO LTD2 citations63
US7883970B2Feb 8, 2011

Semiconductor device having decoupling capacitor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7390547B2Jun 24, 2008

Super resolution information storage medium

SAMSUNG ELECTRONICS CO LTD4 citations63
US7172798B2Feb 6, 2007

High density read only optical disc

SAMSUNG ELECTRONICS CO LTD4 citations63
US11699626B2Jul 11, 2023

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US10699983B2Jun 30, 2020

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations62
US11862570B2Jan 2, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US11562965B2Jan 24, 2023

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61

ELECTRONICS & TELECOMMUNICATIONS RES INST

6 patents

LG ELECTRONICS INC

4 patents

GIGATERA INC

3 patents

KIM HYUN KI

3 patents

KOREA ELECTRONICS TELECOMM

2 patents

KIM HYUN-KI

2 patents

LG DISPLAY CO LTD

2 patents

PARK YONG GOOK

1 patent

EAST WEST TRADING CORP

1 patent

KOREA FUEL TECH CORP

1 patent

EAST WEST TRADING CO

1 patent

YANG JANG BEOM

1 patent

HYUNDAI MOTOR CO LTD

1 patent

Showing the top 50 of 91 patents by PatentIndex Score.