Inventor

OSSIMITZ PETER

DE17 patents

⚠️ This page may combine multiple inventors who share the name “OSSIMITZ PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OSSIMITZ PETER

INFINEON TECHNOLOGIES AG

Chip package having terminal pads of different form factors

Method of manufacturing and testing a chip package

Semiconductor device having a chip under package

Overmolded substrate-chip arrangement with heat sink

Integrated IC package

Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic element

Semiconductor chip having a dense arrangement of contact terminals

Multi-level chip interconnect

Chip arrangement, and method for forming a chip arrangement

Rewiring substrate strip with several semiconductor component positions

Rewiring substrate strip with a number of semiconductor component positions

Circuitry and method for monitoring a power supply of an electronic device

Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith

Rewiring substrate strip having a plurality of semiconductor component positions

OSSIMITZ PETER

Device for releasably receiving a semiconductor chip

Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells

Semiconductor memory component having a diverting circuit