Inventor · disambiguated record
Kirby Sand
Also filed as: SAND KIRBY
12 granted patents·2 pending applications·114 citations·filing 2003–2010
90Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO10CHEN CHIEN-HUA1HALUZAK CHARLES C1HEWLETT PACKARD DEVELOPMENT LP1SAND KIRBY1
Top patents by PatentIndex Score
14 records- 0196US7828417B2Microfluidic device and a fluid ejection device incorporating the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Nov 9, 2010·22 cites·23 claims
- 0295US7303976B2Wafer bonding methodHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Dec 4, 2007·48 cites·8 claims
- 0384US7766462B2Method for forming a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 3, 2010·6 cites·21 claims
- 0478US8007078B2Microfluidic device and a fluid ejection device incorporating the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2010·Granted Aug 30, 2011·2 cites·20 claims
- 0577US6858466B1System and a method for fluid filling wafer level packagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 22, 2005·20 cites·61 claims
- 0672US7611919B2Bonding interface for micro-device packagingHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 3, 2009·4 cites·18 claims
- 0771US8043880B2Microelectronic deviceHEWLETT PACKARD DEVELOPMENT LP·Filed 2005·Granted Oct 25, 2011·4 cites·18 claims
- 0861US7723811B2Packaged MEMS device assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted May 25, 2010·1 cites·11 claims
- 0959US7618682B2Method for providing an anti-stiction coating on a metal surfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Nov 17, 2009·0 cites·14 claims
- 1059US7320899B2Micro-displays and their manufactureHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jan 22, 2008·6 cites·23 claims
- 1152US8390111B2Wafer bonding methodSAND KIRBY·Filed 2007·Granted Mar 5, 2013·1 cites·22 claims
- 1251US7988264B2Method for forming a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2010·Granted Aug 2, 2011·0 cites·14 claims
- 1341US2008068697A1Micro-Displays and Their ManufactureHALUZAK CHARLES C·Filed 2007·Application pending·0 cites
- 1439US2007090479A1Controlling bond fronts in wafer-scale packagingCHEN CHIEN-HUA·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →