P

Inventor

MOCHIZUKI EIJI

JP50 patents
⚠️ This page may combine multiple inventors who share the name “MOCHIZUKI EIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJI ELECTRIC CO LTD

19 patents
USD674760SJan 22, 2013

Semiconductor device

FUJI ELECTRIC CO LTD39 citations93
US6995461B2Feb 7, 2006

Semiconductor device

FUJI ELECTRIC CO LTD52 citations93
US9504154B2Nov 22, 2016

Semiconductor device

FUJI ELECTRIC CO LTD12 citations83
US6905063B2Jun 14, 2005

Method of manufacturing semiconductor device

FUJI ELECTRIC CO LTD7 citations74
US10128166B2Nov 13, 2018

Power semiconductor module

FUJI ELECTRIC CO LTD3 citations73
US10297527B2May 21, 2019

Semiconductor device

FUJI ELECTRIC CO LTD2 citations72
US9786587B2Oct 10, 2017

Semiconductor device and method for manufacturing the semiconductor device

FUJI ELECTRIC CO LTD2 citations71
US8944310B2Feb 3, 2015

Method of manufacturing a semiconductor device

FUJI ELECTRIC CO LTD3 citations63
US12451454B2Oct 21, 2025

Manufacturing method of packaging structure for bipolar transistor with constricted bumps

FUJI ELECTRIC CO LTD0 citations62
US11705419B2Jul 18, 2023

Packaging structure for bipolar transistor with constricted bumps

FUJI ELECTRIC CO LTD0 citations62
US10355089B2Jul 16, 2019

Semiconductor device and semiconductor device manufacturing method

FUJI ELECTRIC CO LTD1 citations62
US11545409B2Jan 3, 2023

Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereof

FUJI ELECTRIC CO LTD0 citations52
US9999146B2Jun 12, 2018

Semiconductor module

FUJI ELECTRIC CO LTD0 citations52
US9406603B2Aug 2, 2016

Semiconductor device and method for manufacturing the semiconductor device

FUJI ELECTRIC CO LTD1 citations51
US10090223B2Oct 2, 2018

Semiconductor device and method of manufacturing same

FUJI ELECTRIC CO LTD1 citations49
US8748225B2Jun 10, 2014

Semiconductor device manufacturing method

FUJI ELECTRIC CO LTD0 citations49
US10090222B2Oct 2, 2018

Semiconductor device with heat dissipation and method of making same

FUJI ELECTRIC CO LTD0 citations41
US9824950B2Nov 21, 2017

Semiconductor device

FUJI ELECTRIC CO LTD0 citations40
US9579746B2Feb 28, 2017

Thermocompression bonding structure and thermocompression bonding method

FUJI ELECTRIC CO LTD0 citations39

RICOH KK

8 patents

FUJI ELEC DEVICE TECH CO LTD

7 patents

FUJI ELECTRIC SYSTEMS CO LTD

2 patents

WISCONSIN ALUMNI RES FOUND

2 patents

HORI MOTOHITO

1 patent

DENTA TOSHIO

1 patent

NISHIMURA YOSHITAKA

1 patent

SAITOH TETSUROU

1 patent

FUKUDA KYOHEI

1 patent

IKAWA OSAMU

1 patent

IDE TAKAYUKI

1 patent

MOCHIZUKI EIJI

1 patent

YOKOMAE TOSHIYUKI

1 patent

MINEGISHI DAIKI

1 patent

RICOH CO LTD

1 patent

ONISHI KAZUNAGA

1 patent