Inventor
CHO YUNRAE
KR7 patents
Patents
7 patentsUS11335668B2May 17, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations70
US12119329B2Oct 15, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11769755B2Sep 26, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US12154881B2Nov 26, 2024
Integrated circuit device having redistribution pattern
SAMSUNG ELECTRONICS CO LTD0 citations58
US11640951B2May 2, 2023
Integrated circuit device having redistribution pattern
SAMSUNG ELECTRONICS CO LTD0 citations58
US12456671B2Oct 28, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations53
US11776894B2Oct 3, 2023
Semiconductor chip including low-k dielectric layer
SAMSUNG ELECTRONICS CO LTD0 citations50