Inventor
HACKENBERG KEN
US6 patents
Patents
6 patentsUS12272614B2Apr 8, 2025
Integrated circuit packages with solder thermal interface materials with embedded particles
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US12062592B2Aug 13, 2024
Integrated circuit packages with thermal interface materials with different material compositions
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US11791237B2Oct 17, 2023
Microelectronic assemblies including a thermal interface material
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US11798861B2Oct 24, 2023
Integrated heat spreader (IHS) with heating element
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US11710677B2Jul 25, 2023
Ultraviolet (UV)-curable sealant in a microelectronic package
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US11710672B2Jul 25, 2023
Microelectronic package with underfilled sealant
INTEL CORP0 citations54