Inventor
CHUNG PHILIP YU-SHUAN
TW15 patents
Patents
15 patentsUS11069671B2Jul 20, 2021
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10535644B1Jan 14, 2020
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12581977B2Mar 17, 2026
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12417927B2Sep 16, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176319B2Dec 24, 2024
Reflow method and system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040309B2Jul 16, 2024
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11996400B2May 28, 2024
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942464B2Mar 26, 2024
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11830746B2Nov 28, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11610859B2Mar 21, 2023
Reflow method and system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11462507B2Oct 4, 2022
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342321B2May 24, 2022
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368149B2Jul 22, 2025
Methods of forming semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11646293B2May 9, 2023
Semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10790261B2Sep 29, 2020
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52