Inventor

STEIMLE ROBERT F

US39 patents

⚠️ This page may combine multiple inventors who share the name “STEIMLE ROBERT F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STEIMLE ROBERT F

FREESCALE SEMICONDUCTOR INC

Memory with charge storage locations and adjacent gate structures

Transistor with independent gate structures

Method of forming a nanocluster charge storage device

Method of making self-aligned split gate memory cell

Split gate memory cell and method therefor

Method for forming a split gate memory device

Method of forming a nanocluster charge storage device

Method of forming an integrated circuit having nanocluster devices and non-nanocluster devices

Method of forming a nanocluster charge storage device

Method for removing nanoclusters from selected regions

Semiconductor device with nanoclusters

Silicided nonvolatile memory and method of making same

Split gate memory cell method

Method for removing nanoclusters from selected regions

Method for retaining nanocluster size and electrical characteristics during processing

Semiconductor device having nitridated oxide layer and method therefor

Method of bond pad protection during wafer processing

Method for forming a non-volatile memory and a peripheral device on a semiconductor substrate

Method of removing nanoclusters in a semiconductor device

Reducing MEMS stiction by increasing surface roughness

Split gate memory cell and method therefor

Method of forming a split gate non-volatile memory cell

Semiconductor device having nitridated oxide layer and method therefor

Nanocluster charge storage device

Rough MEMS surface

Reducing MEMS stiction by deposition of nanoclusters

Systems and methods for anchoring components in MEMS semiconductor devices

Glass frit wafer bond protective structure

Bonded wafer structure having cavities with low pressure and method for forming

Method of discharging a semiconductor device

STEIMLE ROBERT F

MEMS fabrication process with two cavities operating at different pressures

Reducing MEMS stiction by deposition of nanoclusters

Reducing MEMS stiction by deposition of nanoclusters

MONTEZ RUBEN B

Glass frit wafer bond protective structure

Reducing MEMS stiction by introduction of a carbon barrier

Reducing MEMS stiction by introduction of a carbon barrier

MOTOROLA INC

Method for forming a semiconductor device structure in a semiconductor layer

HANNA JEFFREY D

Methods for bonding semiconductor wafers

KARLIN LISA H

Method of making a micro-electro-mechanical-systems (MEMS) device