Inventor
JEON TAEJUN
KR5 patents
Patents
5 patentsUS12205925B2Jan 21, 2025
Semiconductor package having package substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US12400970B2Aug 26, 2025
Semiconductor package including electromagnetic shield structure
SAMSUNG ELECTRONICS CO LTD0 citations58
US12550739B2Feb 10, 2026
Semiconductor package including a metal plate and package-on-package having the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12463126B2Nov 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47
US12308253B2May 20, 2025
Molded product for semiconductor strip and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47