Inventor

TREZZA JOHN

US85 patents

⚠️ This page may combine multiple inventors who share the name “TREZZA JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TREZZA JOHN

TREZZA JOHN

Bowed wafer hybridization compensation

Chip spanning connection

Through chip connection

Processed wafer via

Chip capacitive coupling

Back-to-front via process

Thermally balanced via

Electrically conductive interconnect system and method

Triaxial through-chip connection

Post-attachment chip-to-chip connection

Coaxial through chip connection

Isolating chip-to-chip contact

Remote chip attachment

Isolating chip-to-chip contact

Front-end processed wafer having through-chip connections

Profiled contact

Post &amp; penetration interconnection

Redundant optical device array

Chip-based thermo-stack

Electronic chip contact structure

Inverse chip connector

Process for chip capacitive coupling

XANOPTIX INC

Integrated arrays of modulators and lasers on electronics

Multi-piece fiber optic component and manufacturing technique

Module mounted aligning optical connector

Opto-electronic device integration

Optical fiber ferrule

Multi-wavelength semiconductor laser arrays and applications thereof

Multi-piece fiber optic component and manufacturing technique

Optical fiber ferrule

Integration of fused glass collimated coupler for use in opto-electronic modules

Opto-electronic device integration

Multi-piece fiber optic component and manufacturing technique

CUFER ASSET LTD LLC

Inverse chip connector

Pin-type chip tooling

Stacked chip-based system and method

Coaxial through chip connection

Patterned contact

Chip connector

Rigid-backed, membrane-based chip tooling

Tooling for coupling multiple electronic chips

CUBIC WAFER INC

Coaxial through chip connection

Triaxial through-chip connection

Integrated arrays of modulators and lasers on electronics

Multi-piece fiber optic component and manufacturing technique

Laser and detector device

MISRA ABHAY

Routingless chip architecture

Sensitivity capacitive sensor

CALLAHAN JOHN

Post-seed deposition process

DUGAS ROGER

Tooling for coupling multiple electronic chips

Post & penetration interconnection