Inventor
TAKIGAWA YUKIO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “TAKIGAWA YUKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
9 patentsUS6338903B1Jan 15, 2002
Resin composition for semiconductor encapsulation, method and apparatus for producing the composition, as well as semiconductor device using the composition
FUJITSU LTD19 citations92
US6278192B1Aug 21, 2001
Semiconductor device with encapsulating material composed of silica
FUJITSU LTD45 citations92
US5844309ADec 1, 1998
Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
FUJITSU LTD46 citations92
US5763540AJun 9, 1998
Epoxy resin composition for encapsulating semiconductor
FUJITSU LTD19 citations92
US5659004AAug 19, 1997
Epoxy resin composition
FUJITSU LTD31 citations92
US6693046B2Feb 17, 2004
Method of manufacturing semiconductor device having multilevel wiring
FUJITSU LTD17 citations84
US7211519B2May 1, 2007
Method for manufacturing semiconductor device
FUJITSU LTD12 citations80
US6943115B2Sep 13, 2005
Semiconductor device and method of manufacture thereof
FUJITSU LTD10 citations71
US7390741B2Jun 24, 2008
Method for fabricating semiconductor device
FUJITSU LTD1 citations51