Inventor
LIBRES JEREMIAS P
US9 patents
Patents
9 patentsUS6432749B1Aug 13, 2002
Method of fabricating flip chip IC packages with heat spreaders in strip format
TEXAS INSTRUMENTS INC99 citations96
US6936919B2Aug 30, 2005
Heatsink-substrate-spacer structure for an integrated-circuit package
TEXAS INSTRUMENTS INC64 citations92
US7033864B2Apr 25, 2006
Grooved substrates for uniform underfilling solder ball assembled electronic devices
TEXAS INSTRUMENTS INC16 citations89
US6071457AJun 6, 2000
Bellows container packaging system and method
TEXAS INSTRUMENTS INC19 citations88
US7550856B2Jun 23, 2009
Grooved substrates for uniform underfilling solder ball assembled electronic devices
TEXAS INSTRUMENTS INC10 citations81
US5644168AJul 1, 1997
Mechanical interlocking of fillers and epoxy/resin
TEXAS INSTRUMENTS INC10 citations68
US6214273B1Apr 10, 2001
Molding method with the use of modified runners
TEXAS INSTRUMENTS INC8 citations62
US7135781B2Nov 14, 2006
Low profile, chip-scale package and method of fabrication
TEXAS INSTRUMENTS INC4 citations58
US7309648B2Dec 18, 2007
Low profile, chip-scale package and method of fabrication
TEXAS INSTRUMENTS INC1 citations48