Inventor

GOLDBERG CINDY

US7 patents

⚠️ This page may combine multiple inventors who share the name “GOLDBERG CINDY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST MICROELECTRONICS INC

2 patents

US8987780B2Mar 24, 2015

Graphene capped HEMT device

ST MICROELECTRONICS INC8 citations83

US8900990B2Dec 2, 2014

System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections

ST MICROELECTRONICS INC6 citations72

NXP BV

2 patents

US7691756B2Apr 6, 2010

Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device

NXP BV10 citations82

US7951729B2May 31, 2011

Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device

NXP BV0 citations51

ZHANG JOHN HONGGUANG

1 patent

US8476765B2Jul 2, 2013

Copper interconnect structure having a graphene cap

ZHANG JOHN HONGGUANG24 citations89

FREESCALE SEMICONDUCTOR INC

1 patent

US7994069B2Aug 9, 2011

Semiconductor wafer with low-K dielectric layer and process for fabrication thereof

FREESCALE SEMICONDUCTOR INC4 citations62

ZHANG JOHN H

1 patent

US9002493B2Apr 7, 2015

Endpoint detector for a semiconductor processing station and associated methods

ZHANG JOHN H2 citations61