Inventor
CHAN CHANG-YUEH
TW12 patents
⚠️ This page may combine multiple inventors who share the name “CHAN CHANG-YUEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHAN CHANG-YUEH
5 patentsUS8154115B1Apr 10, 2012
Package structure having MEMS element and fabrication method thereof
CHAN CHANG-YUEH16 citations83
US8618641B2Dec 31, 2013
Leadframe-based semiconductor package
CHAN CHANG-YUEH6 citations79
US8198689B2Jun 12, 2012
Package structure having micro-electromechanical element and fabrication method thereof
CHAN CHANG-YUEH2 citations60
US8564115B2Oct 22, 2013
Package structure having micro-electromechanical element
CHAN CHANG-YUEH0 citations50
US8653661B2Feb 18, 2014
Package having MEMS element and fabrication method thereof
CHAN CHANG-YUEH0 citations40
SILICONWARE PRECISION INDUSTRIES CO LTD
4 patentsUS7858446B2Dec 28, 2010
Sensor-type semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD9 citations84
US8716070B2May 6, 2014
Fabrication method of package structure having MEMS element
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations62
US9254994B2Feb 9, 2016
Package structure having MEMS element
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9130064B2Sep 8, 2015
Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48