Inventor
HASEBE KEIICHI
JP5 patents
Patents
5 patentsUS12384916B2Aug 12, 2025
Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
MITSUBISHI GAS CHEMICAL CO0 citations54
US12325770B2Jun 10, 2025
Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
MITSUBISHI GAS CHEMICAL CO0 citations49
US12534617B2Jan 27, 2026
Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
MITSUBISHI GAS CHEMICAL CO0 citations44
US9351397B2May 24, 2016
Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same
MITSUBISHI GAS CHEMICAL CO0 citations36
US9905328B2Feb 27, 2018
Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
MITSUBISHI GAS CHEMICAL CO0 citations35