Inventor
KASHIMA NAOKI
JP4 patents
Patents
4 patentsUS10703874B2Jul 7, 2020
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
MITSUBISHI GAS CHEMICAL CO1 citations59
US10550228B2Feb 4, 2020
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
MITSUBISHI GAS CHEMICAL CO1 citations58
US9351397B2May 24, 2016
Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same
MITSUBISHI GAS CHEMICAL CO0 citations36
US9905328B2Feb 27, 2018
Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
MITSUBISHI GAS CHEMICAL CO0 citations35