Inventor
HA SEUNGWEON
KR2 patents
Patents
2 patentsUS10658326B2May 19, 2020
Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations45
US12414297B2Sep 9, 2025
Semiconductor device and electronic system including the same
SAMSUNG ELECTRONICS CO LTD0 citations39