Inventor
STIERMAN ROGER J
US9 patents
Patents
9 patentsUS5024746AJun 18, 1991
Fixture and a method for plating contact bumps for integrated circuits
TEXAS INSTRUMENTS INC93 citations93
US4931149AJun 5, 1990
Fixture and a method for plating contact bumps for integrated circuits
TEXAS INSTRUMENTS INC74 citations93
US4861452AAug 29, 1989
Fixture for plating tall contact bumps on integrated circuit
TEXAS INSTRUMENTS INC30 citations87
US4691854ASep 8, 1987
Coatings for ceramic bonding capillaries
TEXAS INSTRUMENTS INC30 citations87
US4979015ADec 18, 1990
Insulated substrate for flip-chip integrated circuit device
TEXAS INSTRUMENTS INC22 citations74
US6534327B2Mar 18, 2003
Method for reworking metal layers on integrated circuit bond pads
TEXAS INSTRUMENTS INC6 citations73
US4874476AOct 17, 1989
Fixture for plating tall contact bumps on integrated circuit
TEXAS INSTRUMENTS INC13 citations68
US7071013B2Jul 4, 2006
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
TEXAS INSTRUMENTS INC2 citations62
US6821791B2Nov 23, 2004
Method for reworking metal layers on integrated circuit bond pads
TEXAS INSTRUMENTS INC2 citations62