Inventor

PEPE ANGEL A

US4 patents

⚠️ This page may combine multiple inventors who share the name “PEPE ANGEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IRVINE SENSORS CORP

2 patents

US5279991AJan 18, 1994

Method for fabricating stacks of IC chips by segmenting a larger stack

IRVINE SENSORS CORP91 citations94

US5406701AApr 18, 1995

Fabrication of dense parallel solder bump connections

IRVINE SENSORS CORP76 citations93

(unassigned)

1 patent

US5635010AJun 3, 1997

Dry adhesive joining of layers of electronic devices

59 citations88

ROCKWELL INTERNATIONAL CORP

1 patent

US5091288AFeb 25, 1992

Method of forming detector array contact bumps for improved lift off of excess metal

ROCKWELL INTERNATIONAL CORP50 citations87