Inventor
KODA TOYOMASA
JP4 patents
Patents
4 patentsUS5299091AMar 29, 1994
Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same
HITACHI LTD29 citations91
US4814288AMar 21, 1989
Method of fabricating semiconductor devices which include vertical elements and control elements
HITACHI LTD27 citations89
US4423433ADec 27, 1983
High-breakdown-voltage resistance element for integrated circuit with a plurality of multilayer, overlapping electrodes
HITACHI LTD15 citations72
US4443812AApr 17, 1984
High-breakdown-voltage semiconductor device
HITACHI LTD2 citations61