Inventor
KOMIYAMA MIKIO
JP6 patents
⚠️ This page may combine multiple inventors who share the name “KOMIYAMA MIKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LINTEC CORP
5 patentsUS5110388AMay 5, 1992
Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape
LINTEC CORP150 citations98
US5356949AOct 18, 1994
Adhesive composition comprising (meth)acrylate polymer and epoxy resin
LINTEC CORP75 citations95
US5118567AJun 2, 1992
Adhesive tape and use thereof
LINTEC CORP100 citations95
US5691038ANov 25, 1997
Cover tape and coating applicator
LINTEC CORP26 citations92
US6139953AOct 31, 2000
Adhesive tape, base material for adhesive tape and their manufacturing methods
LINTEC CORP34 citations89