Inventor

LEE YIT MENG

MY3 patents

⚠️ This page may combine multiple inventors who share the name “LEE YIT MENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NXP USA INC

2 patents

US11984408B2May 14, 2024

Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation

NXP USA INC0 citations58

US10734327B2Aug 4, 2020

Lead reduction for improved creepage distance

NXP USA INC0 citations34

FREESCALE SEMICONDUCTOR INC

1 patent

US7989965B2Aug 2, 2011

Underfill dispensing system for integrated circuits

FREESCALE SEMICONDUCTOR INC1 citations44