Inventor

BENZEL HUBERT

DE73 patents

⚠️ This page may combine multiple inventors who share the name “BENZEL HUBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BENZEL HUBERT

BOSCH GMBH ROBERT

Method for production of a semiconductor component and a semiconductor component produced by said method

Micromechanical component with different doping types so that one type is anodized into porous silicon

Sensor element with trenched cavity

Pressure sensor

Sensor unit including a decoupling structure and manufacturing method therefor

Micromechanical sensor element

Method for mounting semiconductor chips, and corresponding semiconductor chip system

Micromechanical device having two sensor patterns

Method for producing a semiconductor component and a semiconductor component produced according to the method

Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method

Micromechanical sensor

Semiconductor component and a method for producing the same

Method of producing a semiconductor sensor component

Method for producing micromechanic sensors and sensors produced by said method

Method for manufacturing a membrane sensor

Pressure sensor having a silicon chip on a steel diaphragm

Micromechanical pressure sensor

Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor

Micromechanical component and pressure sensor having a component of this type

Micromechanical component and manufacturing method

Micromechanical diaphragm

Sensor, method for producing a sensor and method for mounting a sensor

Micromechanical component and appropriate manufacturing method

Micromechanical component and corresponding production method

Container for an analysis chip

Pressure sensor featuring pressure loading of the fastening element

Micromechanical piezoresistive pressure sensor device

Sensor for measuring pressure in a sealed volume

Micromechanical semiconductor sensor

Method of making a differential pressure sensor

Micropump having a pump diaphragm and a polysilicon layer

Micromechanical device and method for producing a micromechanical device

Electrical through-plating of semiconductor chips

Method for manufacturing a membrane

Micromechanical pressure sensor system

Semiconductor component having a first earlier structure differing from a second earlier structure

AHLES MARCUS

Sensor system, method for operating a sensor system, and method for manufacturing a sensor system

Micromechanical pressure-sensor element and method for its production

Sensor system and method for manufacturing a sensor system

BENZEL HUBERT

Method for producing a semiconductor component and a semiconductor component produced according to the method

Sensor and method for its production

Workpiece composite having a preform and a gel

ENDRESS HAUSER GMBH CO

Capacitive pressure sensors with high linearity by optimizing electrode boundaries

Pressure-measuring arrangement with high linearity

PARAGON AG

Micromechanical component

KRAMER TORSTEN

Method for manufacturing capped MEMS components

BENZEL TIMO

Micromechanical sensor system and corresponding manufacturing method

PIRK TJALF

Micromechanical component having an inclined structure and corresponding manufacturing method

LAMMEL GERHARD

Micromechanical capacitive pressure transducer and production method

MITSCHKE MICHAELA

Pressure sensor having a cap above a first diaphragm connected to a hollow space below a second diaphragm