Inventor

LIU CHAO-YUAN

TW5 patents

⚠️ This page may combine multiple inventors who share the name “LIU CHAO-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

2 patents

US7614888B2Nov 10, 2009

Flip chip package process

ADVANCED SEMICONDUCTOR ENG7 citations72

US8889488B2Nov 18, 2014

Method for manufacturing semiconductor package

ADVANCED SEMICONDUCTOR ENG0 citations49

CHAO SHIN-HUA

1 patent

US8546950B2Oct 1, 2013

Semiconductor package and manufacturing method thereof

CHAO SHIN-HUA0 citations43

UNIV NAT TAIWAN

1 patent

US10775373B2Sep 15, 2020

Method for enhancement of the uniform reaction on the porous materials

UNIV NAT TAIWAN0 citations34

TONG HO-MING

1 patent

US8059422B2Nov 15, 2011

Thermally enhanced package structure

TONG HO-MING0 citations33