Inventor
OKA MIHIR
US3 patents
Patents
3 patentsUS12176318B2Dec 24, 2024
Thermal compression bonder nozzle with vacuum relief features
INTEL CORP0 citations57
US11652080B2May 16, 2023
Thermal compression bonder nozzle with vacuum relief features
INTEL CORP0 citations57
US9659889B2May 23, 2017
Solder-on-die using water-soluble resist system and method
INTEL CORP0 citations46