Inventor
REEDER JEFF
US3 patents
Patents
3 patentsUS7384805B2Jun 10, 2008
Transfer mold semiconductor packaging processes
MICRON TECHNOLOGY INC5 citations70
US7148083B2Dec 12, 2006
Transfer mold semiconductor packaging processes
MICRON TECHNOLOGY INC5 citations70
US7095115B2Aug 22, 2006
Circuit substrates, semiconductor packages, and ball grid arrays
MICRON TECHNOLOGY INC0 citations48