Inventor

LEE SANG-HEUI

KR4 patents

⚠️ This page may combine multiple inventors who share the name “LEE SANG-HEUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US7915727B2Mar 29, 2011

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

SAMSUNG ELECTRONICS CO LTD8 citations82

US9869717B2Jan 16, 2018

Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same

SAMSUNG ELECTRONICS CO LTD6 citations81

US8952510B2Feb 10, 2015

Semiconductor chip and film and tab package comprising the chip and film

SAMSUNG ELECTRONICS CO LTD3 citations61

CHOI KYOUNG-SEI

1 patent

US8222089B2Jul 17, 2012

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

CHOI KYOUNG-SEI10 citations81