Inventor
SON DAE-WOO
KR12 patents
⚠️ This page may combine multiple inventors who share the name “SON DAE-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
9 patentsUS6103554AAug 15, 2000
Method for packaging integrated circuits with elastomer chip carriers
SAMSUNG ELECTRONICS CO LTD74 citations94
US7915727B2Mar 29, 2011
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD8 citations82
US6421456B1Jul 16, 2002
Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks
SAMSUNG ELECTRONICS CO LTD15 citations82
US7339262B2Mar 4, 2008
Tape circuit substrate and semiconductor apparatus employing the same
SAMSUNG ELECTRONICS CO LTD8 citations73
US7247936B2Jul 24, 2007
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US6902261B2Jun 7, 2005
Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly
SAMSUNG ELECTRONICS CO LTD4 citations62
US8952510B2Feb 10, 2015
Semiconductor chip and film and tab package comprising the chip and film
SAMSUNG ELECTRONICS CO LTD3 citations61
US6818542B2Nov 16, 2004
Tape circuit board and semiconductor chip package including the same
SAMSUNG ELECTRONICS CO LTD3 citations57
US6737590B2May 18, 2004
Tape circuit board and semiconductor chip package including the same
SAMSUNG ELECTRONICS CO LTD2 citations57