Inventor

JO SANG-GUI

KR7 patents

⚠️ This page may combine multiple inventors who share the name “JO SANG-GUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US7915727B2Mar 29, 2011

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

SAMSUNG ELECTRONICS CO LTD8 citations82

US7952199B2May 31, 2011

Circuit board including solder ball land having hole and semiconductor package having the circuit board

SAMSUNG ELECTRONICS CO LTD4 citations61

US7667325B2Feb 23, 2010

Circuit board including solder ball land having hole and semiconductor package having the circuit board

SAMSUNG ELECTRONICS CO LTD1 citations50

JO SANG-GUI

2 patents

US8828795B2Sep 9, 2014

Method of fabricating semiconductor package having substrate with solder ball connections

JO SANG-GUI0 citations44

US8304892B2Nov 6, 2012

Semiconductor package having substrate with solder ball connections and method of fabricating the same

JO SANG-GUI0 citations44

CHOI KYOUNG-SEI

1 patent

US8222089B2Jul 17, 2012

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

CHOI KYOUNG-SEI10 citations81

PARK JI-YONG

1 patent

US8466554B2Jun 18, 2013

Electronic device having interconnections, openings, and pads having greater width than the openings

PARK JI-YONG3 citations61