Inventor

KUMMERL STEVEN A

US9 patents

⚠️ This page may combine multiple inventors who share the name “KUMMERL STEVEN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

5 patents

US7578422B2Aug 25, 2009

KUMMERL STEVEN A

2 patents

US8569082B2Oct 29, 2013

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

KUMMERL STEVEN A18 citations90

US8072770B2Dec 6, 2011

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

KUMMERL STEVEN A4 citations60

SAHASRABUDHE KAPIL H

1 patent

US8154109B2Apr 10, 2012

Leadframe having delamination resistant die pad

SAHASRABUDHE KAPIL H2 citations51

AMARO MICHAEL G

1 patent

US8304868B2Nov 6, 2012

Multi-component electronic system having leadframe with support-free with cantilever leads

AMARO MICHAEL G0 citations48

KUMMERL STEVEN A

TEXAS INSTRUMENTS INC

Bond capillary design for ribbon wire bonding

Semiconductor device having firmly secured heat spreader

Multi lead frame power package

Structure and method for sealing cavity of micro-electro-mechanical device

Integrated circuit chip packaging assembly

KUMMERL STEVEN A

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

SAHASRABUDHE KAPIL H

Leadframe having delamination resistant die pad

AMARO MICHAEL G

Multi-component electronic system having leadframe with support-free with cantilever leads