Inventor · disambiguated record
Ivy Wei Qin
Also filed as: QIN IVY WEI
9 granted patents·41 citations·filing 2004–2022
84Inventor score
Top patents by PatentIndex Score
9 records- 0184US7584881B2Low loop height ball bonding method and apparatusKULICKE & SOFFA IND INC·Filed 2007·Granted Sep 8, 2009·12 cites·5 claims
- 0280US9496240B2Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loopsQIN IVY WEI·Filed 2010·Granted Nov 15, 2016·5 cites·20 claims
- 0375US7347352B2Low loop height ball bonding method and apparatusKULICKE & SOFFA IND INC·Filed 2004·Granted Mar 25, 2008·21 cites·16 claims
- 0473US11495570B2Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loopsKULICKE & SOFFA IND INC·Filed 2022·Granted Nov 8, 2022·0 cites·19 claims
- 0561US11276666B2Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loopsKULICKE & SOFFA IND INC·Filed 2019·Granted Mar 15, 2022·0 cites·19 claims
- 0658US8302841B2Wire payout measurement and calibration techniques for a wire bonding machineQIN IVY WEI·Filed 2009·Granted Nov 6, 2012·2 cites·22 claims
- 0754US10361168B2Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loopsKULICKE & SOFFA IND INC·Filed 2016·Granted Jul 23, 2019·0 cites·20 claims
- 0850US8063305B2Method of forming bends in a wire loopQIN IVY WEI·Filed 2007·Granted Nov 22, 2011·1 cites·9 claims
- 0943US9016107B2Method of calibrating a constant voltage supply for an ultrasonic transducer of a wire bonding machineQIN IVY WEI·Filed 2007·Granted Apr 28, 2015·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →