Inventor

YU YU-CHIH

TW3 patents

Patents

3 patents

US8810045B2Aug 19, 2014

Packaging substrate and semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations59

US9165789B2Oct 20, 2015

Fabrication method of packaging substrate

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48

US9006039B2Apr 14, 2015

Fabrication method of packaging substrate, and fabrication method of semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48