Inventor
HONG DO WOONG
KR3 patents
Patents
3 patentsUS10590272B2Mar 17, 2020
Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same
DOOSAN CORP1 citations55
US10584239B2Mar 10, 2020
Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same
DOOSAN CORP1 citations55
US9957389B2May 1, 2018
Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate
DOOSAN CORP0 citations42